Technology Overview

HV CMOS

Large Display IC를 위한 모든 Technology 완벽 지원 설명

HV CMOS

TV 1.8/18V (HD180IHL5) 1.2V/18V FEOL 110nm IT Tablet Notebook Monitor 1.8/9V/13.5V (HD180IEL6)
Available (Mass Prod.) Available (New) Under Developing Under Planning

한국 No. 1 DDI 공급 파운드리

검증된 기술력

고품질 Driver IC 양산에 적합한 안정된 Fab 공정

Design Infra Service

BCDMOS

약어 L/S* : Level Shifter, Load Switch C/P : Charge Pump

BCDMOS
Target Applications	HB180ENH: High Performance
	1.8V, 5.0V(6.0V), 12V~40V 23 Layers ⓐ MV & HV, 1P3M Zener Diode(6.2/7.2V), SBD(20V), MiM, HRI MTP / OTP IP SRAM(1.8V Compiler / 5.0V)
	HB180ENH3: Ultra High Performance
Ultra Low Ron.sp High Performance 150nm BEOL Design Rule HDP Full-fill Passivation Cost effective OTP/MTP and SRAM IP Various Option Devices Proven through Many MP Histories	1.8V, 5.0V, 12V~30V(40V) Ultra Low Ron.sp LDMOS 21 Layers ⓐ 5V & HV (~30V), 1P3M Fully Isolated LD/DENMOS(~24V) Zener Diode(6.2V), 20V SBD(Q3’ 19), MiM, HRI YMC MTP, OTP, SRAM(1.8V / 5.0V)

CIS

검증된 픽셀, 고객 Needs 및 제품 특성에 따라 맞춤형 서비스를 제공 하고 있습니다.

Logic/eFlash

Mask Reduction이 완성된 Industry Standard eFlash Solution

MEMS

MEMS Microphone Chip Table
MEMS Microphone Chip 구조

MEMS Mic. Sensor	MEMS Mic. RIOC
MEMS Specialty Process - Thick Film - Deep Si Etching - Sacrificial Etching	CMOS Process - 0.18um Tech - Mixed Signal - 1.8V/3.3V

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