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    • Technology Overview

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    HV CMOS

    Fully Coverage Technology for Large Display
    Fully Coverage Technology for Large Display
    HV CMOS
    TV
    • 1.8/18V
      (HD180IHL5)
    • 1.2V/18V
      FEOL 110nm

    IT

    • Tablet
    • Notebook
    • Monitor
    • 1.8/9V/13.5V
      (HD180IEL6)
    Available (Mass Prod.)
    Available (New)
    Under Developing
    Under Planning

    No. 1 Supplier in Korea

    • - Major Supplier of Top Tier Customer
    • - World Wide Fabless company engaged

    Qualified Technologies

    • - Mass Production History over 2,000Kwfs (* HD ~ UHD TV)
    • - Mass Production Stage of OLED TV (>3Kwfs/Month)

    Stabilized FAB Process for Advanced Driver ICs

    • - High Speed Interface IP verified
    • - OLED Driver IC verified

    Design Infra Service

    • - STD Cell Lib./P-Cell/Symbol/Monte-Carlo/Etc

    BCDMOS

    Cost Effective and High Performance
    BCDMOS 이미지1.
    缩略语 L/S* : Level Shifter, Load Switch C/P : Charge Pump
    BCDMOS Tech. Global Leader
    BCDMOS
    Target Applications HB180ENH: High Performance
    BCDMOS 이미지
    • 1.8V, 5.0V(6.0V), 12V~40V
    • 23 Layers ⓐ MV & HV, 1P3M
    • Zener Diode(6.2/7.2V), SBD(20V), MiM, HRI
    • MTP / OTP IP
    • SRAM(1.8V Compiler / 5.0V)
    HB180ENH3: Ultra High Performance
    • Ultra Low Ron.sp High Performance
    • 150nm BEOL Design Rule
    • HDP Full-fill Passivation
    • Cost effective OTP/MTP and SRAM IP
    • Various Option Devices
    • Proven through Many MP Histories
    • 1.8V, 5.0V, 12V~30V(40V)
    • Ultra Low Ron.sp LDMOS
    • 21 Layers ⓐ 5V & HV (~30V), 1P3M
    • Fully Isolated LD/DENMOS(~24V)
    • Zener Diode(6.2V), 20V SBD(Q3’ 19), MiM, HRI
    • YMC MTP, OTP, SRAM(1.8V / 5.0V)

    CIS

    CIS Specialty Solution for Customer

    根据验证过的Pixel, 客户的需求和产品的特性提供相匹配的服务

    CIS 이미지 1
    CIS 이미지 2

    Logic/eFlash

    Cost Effective 110nm Logic/eFlash Technology

    完成了Mask Reduction的Industry Standard eFlash Solution

    YMC와 SST eFlash의 가격 공정 비교 테이블 이미지

    MEMS

    MEMS Microphone 开发中 (预计’21年结束)
    MEMS Microphone Chip Table
    MEMS Microphone Chip 구조
    MEMS Microphone Chip 구조 이미지
    MEMS Mic. Sensor MEMS Mic. RIOC
    MEMS Specialty Process
    • - Thick Film
    • - Deep Si Etching
    • - Sacrificial Etching
    		 CMOS Process
    • - 0.18um Tech
    • - Mixed Signal
    • - 1.8V/3.3V
    응용처
    응용처
    MEMS 마이크로폰 응용 산업 영역 이미지 (노트북, 스마트폰, 해드셋, LOT, Automotive & Medical, Consumer)